POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
IPC0051 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. POWERSOIC-8/PSOP-8/HSOP-8 TO DIP. Key specifications: material FR4 Epoxy Glass, size / dimension 1.000" x 0.600" (25.40mm x 15.24mm), number of positions 8, pitch 0.050" (1.27mm).
In Stock: 37
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | PowerSOIC, PSOP, HSOP |
| Number of Positions | 8 |
| Pitch | 0.050" (1.27mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 1.000" x 0.600" (25.40mm x 15.24mm) |
Submit your RFQ for IPC0051 and get a quote within 24 hours.
3J LIMITED
