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DIP300-SOIC-20W - Chip Quik Inc. - Adapter, Breakout Boards

DIP300-SOIC-20W

Chip Quik Inc.

DIP-20 (0.3" WIDTH, 0.1" PITCH)

DIP300-SOIC-20W is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. DIP-20 (0.3" WIDTH, 0.1" PITCH). Key specifications: material FR4 Epoxy Glass, size / dimension 1.000" L x 0.400" W (25.40mm x 10.16mm), number of positions 20, pitch 0.050" (1.27mm).

In Stock: 4

Product Attributes

AttributeValue
Proto Board TypeSMD to DIP
Package AcceptedSOIC
Number of Positions20
Pitch0.050" (1.27mm)
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
Size / Dimension1.000" L x 0.400" W (25.40mm x 10.16mm)

Frequently Asked Questions

DIP300-SOIC-20W is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. DIP-20 (0.3" WIDTH, 0.1" PITCH)

The material of DIP300-SOIC-20W is FR4 Epoxy Glass.

The size of DIP300-SOIC-20W is 1.000" L x 0.400" W (25.40mm x 10.16mm).

The number of positions of DIP300-SOIC-20W is 20.

The pitch of DIP300-SOIC-20W is 0.050" (1.27mm).

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