DIP-18 (0.3" WIDTH, 0.1" PITCH)
DIP300-SOIC-18W is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. DIP-18 (0.3" WIDTH, 0.1" PITCH). Key specifications: material FR4 Epoxy Glass, size / dimension 0.900" L x 0.400" W (22.86mm x 10.16mm), number of positions 18, pitch 0.050" (1.27mm).
In Stock: 39
| Attribute | Value |
|---|---|
| Proto Board Type | SMD to DIP |
| Package Accepted | SOIC |
| Number of Positions | 18 |
| Pitch | 0.050" (1.27mm) |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.900" L x 0.400" W (22.86mm x 10.16mm) |
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3J LIMITED
