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DIP300-SOIC-16W - Chip Quik Inc. - Adapter, Breakout Boards

DIP300-SOIC-16W

Chip Quik Inc.

DIP-16 (0.3" WIDTH, 0.1" PITCH)

DIP300-SOIC-16W is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. DIP-16 (0.3" WIDTH, 0.1" PITCH). Key specifications: material FR4 Epoxy Glass, size / dimension 0.800" L x 0.400" W (20.30mm x 10.16mm), number of positions 16, pitch 0.050" (1.27mm).

In Stock: 4

Product Attributes

AttributeValue
Proto Board TypeDIP to SMD
Package AcceptedDIP
Number of Positions16
Pitch0.050" (1.27mm)
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
Size / Dimension0.800" L x 0.400" W (20.30mm x 10.16mm)

Frequently Asked Questions

DIP300-SOIC-16W is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. DIP-16 (0.3" WIDTH, 0.1" PITCH)

The material of DIP300-SOIC-16W is FR4 Epoxy Glass.

The size of DIP300-SOIC-16W is 0.800" L x 0.400" W (20.30mm x 10.16mm).

The number of positions of DIP300-SOIC-16W is 16.

The pitch of DIP300-SOIC-16W is 0.050" (1.27mm).

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