200X100MIL PADS, SOIC FOOTPRINT
SMT3U is a Prototype Boards Perforated manufactured by BusBoard Prototype Systems. 200X100MIL PADS, SOIC FOOTPRINT. Key specifications: size / dimension 6.30" L x 3.90" W (160.0mm x 99.1mm), pitch 0.100" (2.54mm).
In Stock: 24
| Attribute | Value |
|---|---|
| Proto Board Type | Breadboard, Surface Mount |
| Plating | Non-Plated Through Hole (NPTH) |
| Pitch | 0.100" (2.54mm) |
| Circuit Pattern | Pad Per Hole (Rectangular) |
| Edge Contacts | - |
| Hole Diameter | 0.031" (0.79mm) |
| Size / Dimension | 6.30" L x 3.90" W (160.0mm x 99.1mm) |
| Board Thickness | 0.063" (1.60mm) |
Submit your RFQ for SMT3U and get a quote within 24 hours.
3J LIMITED
