System-In-Package based on Renes
MSRZG3S-BAA is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by ARIES Embedded. System-In-Package based on Renes. Key specifications: operating temperature 0°C ~ 70°C, size / dimension 1.181" L x 1.181" W (30.00mm x 30.00mm).
In Stock: 3
| Attribute | Value |
|---|---|
| Module/Board Type | - |
| Core Processor | - |
| Co-Processor | - |
| Speed | - |
| Flash Size | 4GB eMMC |
| RAM Size | 1GB |
| Connector Type | - |
| Size / Dimension | 1.181" L x 1.181" W (30.00mm x 30.00mm) |
| Operating Temperature | 0°C ~ 70°C |
Submit your RFQ for MSRZG3S-BAA and get a quote within 24 hours.
3J LIMITED
