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32-6554-10 - Aries Electronics - Sockets for ICs, Transistors

32-6554-10

Aries Electronics

CONN IC DIP SOCKET ZIF 32POS TIN

32-6554-10 is a Sockets for ICs, Transistors manufactured by Aries Electronics. CONN IC DIP SOCKET ZIF 32POS TIN. Key specifications: mounting type Through Hole, housing material Polyphenylene Sulfide (PPS), Glass Filled, termination Solder.

In Stock: 731

Product Attributes

AttributeValue
Product StatusActive
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBeryllium Copper
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-

Frequently Asked Questions

32-6554-10 is a Sockets for ICs, Transistors manufactured by Aries Electronics. CONN IC DIP SOCKET ZIF 32POS TIN

The mounting type of 32-6554-10 is Through Hole.

The material of 32-6554-10 is Polyphenylene Sulfide (PPS), Glass Filled.

The termination type of 32-6554-10 is Solder.

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