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28-6554-11 - Aries Electronics - Sockets for ICs, Transistors

28-6554-11

Aries Electronics

CONN IC DIP SOCKET ZIF 28POS GLD

28-6554-11 is a Sockets for ICs, Transistors manufactured by Aries Electronics. CONN IC DIP SOCKET ZIF 28POS GLD. Key specifications: mounting type Through Hole, housing material Polyphenylene Sulfide (PPS), Glass Filled, termination Solder.

In Stock: 507

Product Attributes

AttributeValue
Product StatusActive
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating-
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post-
Contact Material - PostBeryllium Copper
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-

Frequently Asked Questions

28-6554-11 is a Sockets for ICs, Transistors manufactured by Aries Electronics. CONN IC DIP SOCKET ZIF 28POS GLD

The mounting type of 28-6554-11 is Through Hole.

The material of 28-6554-11 is Polyphenylene Sulfide (PPS), Glass Filled.

The termination type of 28-6554-11 is Solder.

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