Advanced Thermal Solutions Inc.
DUALFLOW HEATSINK 1U VAPOR
ATS-UC-DFLOW-VC-200 is a Thermal - Heat Sinks manufactured by Advanced Thermal Solutions Inc.. DUALFLOW HEATSINK 1U VAPOR. Key specifications: material Copper.
In Stock: 15
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount, Zipper Fin |
| Package Cooled | Intel LGA2011 & LGA2066 CPU Cooler |
| Attachment Method | Push Pin |
| Shape | Square, Fins |
| Length | 3.637" (92.38mm) |
| Width | 3.626" (92.11mm) |
| Diameter | - |
| Fin Height | 1.142" (29.00mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Material | Copper |
| Material Finish | Nickel |
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3J LIMITED
