RFQ List

No items in your RFQ list

Estimated Total: $0.00
View RFQ List
BY25Q16BSSIG(T) - BYTe Semiconductor - Memory

BY25Q16BSSIG(T)

BYTe Semiconductor

IC FLASH 16MBIT SPI/QUAD 8SOP

BY25Q16BSSIG(T) is a Memory manufactured by BYTe Semiconductor. IC FLASH 16MBIT SPI/QUAD 8SOP. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply 2.7V ~ 3.6V, package / case 8-SOIC (0.209", 5.30mm Width).

In Stock: 9,500

Product Attributes

AttributeValue
DigiKey ProgrammableVerified
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size16Mbit
Memory Organization2M x 8
Memory InterfaceSPI - Quad I/O, QPI
Clock Frequency108 MHz
Write Cycle Time - Word, Page50µs, 2.4ms
Access Time7 ns
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Grade-
Qualification-
Mounting TypeSurface Mount
Package / Case8-SOIC (0.209", 5.30mm Width)
Supplier Device Package8-SOP

Frequently Asked Questions

BY25Q16BSSIG(T) is a Memory manufactured by BYTe Semiconductor. IC FLASH 16MBIT SPI/QUAD 8SOP

The mounting type of BY25Q16BSSIG(T) is Surface Mount.

The operating temperature range of BY25Q16BSSIG(T) is -40°C ~ 85°C (TA).

The supply voltage of BY25Q16BSSIG(T) is 2.7V ~ 3.6V.

The memory specification of BY25Q16BSSIG(T) is 16Mbit.

Alternative Products

Part NumberManufacturerDescriptionMatch
BY25Q16ESSIG(R) BYTe Semiconductor IC FLASH 16MBIT SPI/QUAD 8SOP 100% View
W25Q256FVFAQ Winbond Electronics IC FLASH 98% View
EM008LXQBB313CS1T Everspin Technologies Inc. IC RAM 8MBIT XSPI/QUAD 24TBGA 83% View
EM008LXQBB313ES2T Everspin Technologies Inc. IC RAM 8MBIT XSPI 24TBGA 83% View
EM008LXQBDH13ES2T Everspin Technologies Inc. IC RAM 8MBIT XSPI 8DFN 83% View
W25N02KVZEIU TR Winbond Electronics IC FLASH 2GBIT SPI 8WSON 80% View

Related Products

Manufacturers in Memory

Need a Quote for This Part?

Submit your RFQ for BY25Q16BSSIG(T) and get a quote within 24 hours.

Top
Live Chat
Hello! How can we help you today? Feel free to ask about pricing, availability, or technical details.