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LPC18S30FET256551 - NXP USA Inc. - Embedded - Microcontrollers

LPC18S30FET256551

NXP USA Inc.

IC MCU 32BIT ROMLESS 256LBGA

LPC18S30FET256551 is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC MCU 32BIT ROMLESS 256LBGA. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply (vcc/vdd) 2.2V ~ 3.6V, package / case 256-LBGA.

In Stock: 5,857

Product Attributes

AttributeValue
Product StatusActive
Core ProcessorARM® Cortex®-M3
Core Size32-Bit Single-Core
Speed180MHz
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O164
Program Memory Size-
Program Memory TypeROMless
EEPROM Size-
RAM Size200K x 8
Voltage - Supply (Vcc/Vdd)2.2V ~ 3.6V
Data ConvertersA/D 8x10b; D/A 1x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case256-LBGA
Supplier Device Package256-LBGA (17x17)

Frequently Asked Questions

LPC18S30FET256551 is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC MCU 32BIT ROMLESS 256LBGA

The mounting type of LPC18S30FET256551 is Surface Mount.

The operating temperature range of LPC18S30FET256551 is -40°C ~ 85°C (TA).

The supply voltage of LPC18S30FET256551 is 2.2V ~ 3.6V.

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