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DILB24P-223TLF - Amphenol ICC (FCI) - Sockets for ICs, Transistors

DILB24P-223TLF

Amphenol ICC (FCI)

CONN IC DIP SOCKET 24POS TINLEAD

DILB24P-223TLF is a Sockets for ICs, Transistors manufactured by Amphenol ICC (FCI). CONN IC DIP SOCKET 24POS TINLEAD. Key specifications: mounting type Through Hole, operating temperature -55°C ~ 125°C, housing material Polyamide (PA), Nylon, termination Solder.

In Stock: 7,984

Product Attributes

AttributeValue
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)24 (2 x 12)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin-Lead
Contact Finish Thickness - Mating100.0µin (2.54µm)
Contact Material - MatingCopper Alloy
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post100.0µin (2.54µm)
Contact Material - PostCopper Alloy
Housing MaterialPolyamide (PA), Nylon
Operating Temperature-55°C ~ 125°C

Frequently Asked Questions

DILB24P-223TLF is a Sockets for ICs, Transistors manufactured by Amphenol ICC (FCI). CONN IC DIP SOCKET 24POS TINLEAD

The mounting type of DILB24P-223TLF is Through Hole.

The operating temperature range of DILB24P-223TLF is -55°C ~ 125°C.

The material of DILB24P-223TLF is Polyamide (PA), Nylon.

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